Rotatable Sputtering Targets Merits and Weakness

Sputtering is a high-speed process where superfast ions hit a sputtering target and dislodge minuscule particles that in turn coat a thin film on substrates like architectural glass, LED televisions and computer displays.

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Rotatable sputtering target, or rotatory target, is a commonly used target shape in magnetron sputtering. It is generally cylindrical, with a stationary magnet inside, and a slow magnetic field, which allows the sputtering rate to be uniform and the target utilization rate to be high. Rotating targets are commonly used for coating solar cells, architectural glass, automotive glass, semiconductors, and flat-panel TVs.

The main advantage of the rotatable target is the high utilization of the target, which means that the rotating target can solve the problem of low utilization of the planar target.

For a planar sputtering target, the target utilization of the normal cathode can reach 25%, and the special design of the magnet bypass with the target back can increase the target utilization to about 40%. Despite this, the utilization of planar targets is still not high. However, the utilization of cylindrical rotating targets is typically in the range of 75% to 90%, much higher than planar targets. However, when the rotating target is used for large-area coating, the uniformity of the surface of the film layer is poor and it is difficult to meet the requirements, which is the biggest disadvantage of the rotating target.

Materials Planar Rotatory Metal Planar molybdenum target, planar copper target, planar titanium target, planar tungsten target, planar zirconia target

 

Rotatory molybdenum target, rotatory copper target, rotatory titanium target, rotatory tungsten target, rotatory zirconia target

 

Oxides Planar SiO2 Sputtering Target Rotatory ATO Sputtering Target, rotary Nb2Ox sputtering target, rotatory TiOx sputtering target, rotatory Al2O3 sputtering target Alloy Planar Cr-Ta sputtering target, planar Ti-Al-Si sputtering target SnO2-Sb2O3 rotatory sputtering target

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SAM Sputter Targets

Stanford Advanced Materials (SAM) Corporation is a global supplier of various sputtering targets such as metals, alloys, oxides, ceramic materials. View all posts by SAM Sputter Targets

Rotary Target Advantages

Rotary Targets

Rotary sputtering target technology has been widely used in thin film deposition, especially for large area coating, such as architectural glass and flat panel displays coating manufacturing. The standard manufacturing methods are plasma spraying onto the base tubes, casting, and extrusion of the complete assembly.

Rotary Target Advantages

·    Comparing with planar sputtering target , the rotary sputter target contains more material and offers a greater utilization, which means longer production runs and reduced downtime of the system, increases the throughput of the coating equipment. Besides, rotatable targets allow the use of higher power densities due to the heat build-up being spread evenly over the surface area of the target. As a consequence, an increased deposition speed can be seen along with improved performance during reactive sputtering

·       Compared to planar targets, rotary targets generally have more surface area per given length.

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·       Rotary targets have much more surface area, so the magnetron power can be spread out over a larger area in a given amount of time. This helps keep the target running cooler, decreases nodule formation, and reduces the occurrence of arcing.

1.      Since rotary sputtering decreases nodule formation, targets can have longer continuous runtimes.

2.      There is generally more material available to sputter on a rotary target, which increases runtimes.

3.      Rotary target utilization is usually ~80%, as opposed to ~30% for planar targets &#; which decreases scrap and increases runtimes.

 

·       Rotary targets are well suited for continuous sputtering processes. Continuous processing increases throughput since there is less time wasted preparing the sputtering chamber.

 

·       Rotary targets are more cost effective for high volume processes. They provide a good platform for long runtime processes, with less chance of defects and downtime.

 

·       Planar targets are still best suited for prototype work or elemental experimentation, especially when large amounts of material are not needed at once.