What is the SMT process and why should OEMs care?
What is the SMT process and why should OEMs care?
Original Equipment Manufacturers (OEMs) are organisations that manufacture or sell products to another company. This company then uses these components in part of a wider process to create products for their customers under their own branding. A big part of creating products to sell on to other companies centres around the SMT process.
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What is SMT?
Surface mount technology (SMT) is the process wherein components are mounted onto the surface of a printed circuit board. The components are designed specifically to be directly mounted, rather than hardwired, onto the circuit board for the vast majority of electronics.
Surface mount technology has been widely used since the s. This is because the SMT process is automated, meaning it saves time and costs for both the manufacturer and the customer. Previous methods used hand wiring through holes between the boards to bring components together, meaning this needed manual labour to do so and of course, risked human error. The SMT process is also more adaptable for technological advances in the future than the through hole wire method.
Other advantages of surface mount technology include higher component density and smaller components for mounting alongside better performance under pressure. Using surface mount technology also means that either side of the board can have components mounted on it.
What is the typical SMT process?
There are three main steps to the process when it comes to surface mount technology which cover solder paste printing, component placing and reflow soldering.
Solder paste printing
The solder paste printing process is carried out by a machine to ensure accuracy and speed.
During this part of the assembly, a printer applies solder paste using a pre-made stencil of the PCB and squeegees. This solder paste is usually a mixture of flux and tin and its used to connect the SMC and solder pads on the PCB.
During this part of the process, its vital that each pad is covered in the correct amount of paste. If not, a connection will not be established when the solder is melted in the reflow oven (more on that later).
Controlling the quality of the solder paste printing process is vital. This is because, if any printing defects are left undetected at this stage, they will lead to other defects further down the line. For this reason, the design of the stencil is key and care must be taken by the assembly team to ensure that the process is repeatable and stable. Thankfully, to smooth the process, most solder paste printers have the option of including an automatic inspection.
However, sometimes external machines are used to assess the quality of the printing. These solder printer inspection machines use 3D technology and allow for a more thorough inspection. This is because they check for things like solder paste volume per pad, rather than just the print area.
Components placement
Once the PCB has passed inspection, it moves to the component placement phase of the SMT assembly process.
During this phase, each component that will be mounted on the PCB is removed from its packaging using a vacuum or a gripper nozzle. Following this, a machine places it in its programmed location. Not only are the machines that carry out this process highly accurate, but theyre also incredibly quick. Some of the most advanced machines can place 80,000 individual components every hour.
When all the individual components have been placed on the PCB, they must be inspected to ensure that theyve been placed correctly. This is an incredibly important step in the process, because if any placement errors go undetected and the parts are soldered into that position, then this can lead to high volumes of rework, which can be both costly and time-consuming.
Reflow soldering
Once the placed components have passed their inspection, the process moves to the reflow soldering phase. During this part of the SMT process, the PCB is placed into a reflow soldering machine (some people refer to them as reflow ovens).
Here, all the electrical solder connections are formed between the components and the PCB. Using heat, the solder paste applied earlier is converted into a solder. Again, accuracy is vital during this stage of the process because if the PCB is heated to a temperature thats too high, the parts or assembly could become damaged and the PCB wont function as intended. If the temperature is too low, a connection may not be established.
To ensure the best results, all PCBs within the soldering machine are placed on a conveyor belt. Theyre then heated gradually in a series of zones before being passed through a cooling zone.
To avoid joint defects, the PCBs must stay in each zone for the correct period of time. The PCBs must then also be entirely cooled before theyre handled or moved. If not, they may warp.
After the PCBs have been through the reflow solder machine, they are inspected one final time. This inspection is usually carried out by a 3D automated optical inspection machine (AOI). This is to ensure that the solder joint quality is as expected and that no mistakes have been made during the SMT process. Machines are used for this process because theyre much quicker than humans, and more accurate in their analysis.
How is ABL different?
A tailored service:
ABL Circuits offers a tailored and personal service for all OEMs. We are a one-stop shop for all your PCB manufacturing needs, and can take the entire process from start to end off your hands, or alternatively, assist with an individual aspect along the way.
Family values
We are a family run business which began modestly at our founder, Mark Leveretts home. 36 years on, William Leverett is now director and is helping to run the company with his father. Family is at the heart of everything we do, which means you get a personal and passionate service.
Decades of experience
With over 36 years of experience under our belt, ABL Circuits has a wealth of knowledge across our employees, alongside the newest state of the art technology. As one of the only manufacturers that offer the full start-to-end process, in-house, for PCB assembly, we can help to guide you through every step.
We respect your budget
We work with a range of SMEs and bigger companies and know that it is not one size fits all when it comes to budget and delivery. We work closely with each of our customers to understand what they are looking for and how we can provide this in the most cost efficient way, without compromising on quality.
If youd like to find out more about how we work and how we can help you, get in touch for a free quote.
Surface Mount Technology
Surface Mount Technology (SMT) is used in the electronic industry to assemble and solder electronic components directly onto the surface of printed circuit boards. Unlike through-hole technology, where components have leads inserted into drilled holes, SMT components have small leads or no leads, relying on solder paste and a reflow soldering process to establish electrical connections.
What is Surface Mount Technology (SMT)?
Surface Mount Technology is a method for assembling electronic components onto printed circuit boards (PCBs). Unlike traditional through-hole technology, where components have leads inserted through holes in the PCB, SMT involves mounting components directly onto the surface of the PCB. The SMT offers advantages such as smaller form factors and improved manufacturing efficiency and compatibility with the automated assembly processes.
SMT Manufacturing Process
The SMT manufacturing process involves the following key steps:
1. Component Placement
The Tiny electronic components including resistors, capacitors, and printed antennas mentioned earlier are picked and placed on PCB using the specialized robotic machinery. These components are provided in the form of the Surface Mount Devices (SMDs).
2. Solder Paste Application
The Solder paste a sticky mixture of the solder alloy particles and flux is applied to the PCBs pads using the stencil. The solder paste is positioned in the locations where components will be placed and soldered.
3. Component Soldering
The PCB with solder paste applied is passed through a reflow oven. The heat in oven melts the solder paste is allowing the components to adhere to the pads on PCB. As the assembly cools and the solder solidifies forming strong electrical connections.
4. Inspection and Testing
The assembly undergoes visual inspection and testing to identify defects soldering issues or incorrect placements. Automated optical inspection and X-ray techniques are often used for the thorough examination.
Evolution and Reasons
The SMT evolved as a response to the demand for miniaturization, improved performance, and higher production speeds in the electronics industry. As electronic devices became smaller and more complex, traditional through-hole assembly methods became limiting due to larger component sizes and increased assembly time.
Effects
The adoption of SMT has led to significant advancements in electronics manufacturing, including:
The Miniaturization of the electronic devices.
The Enhanced performance due to shorter signal paths.
To Increased production efficiency and reduced manufacturing costs.
Types of Surface Mount Components
1. Surface Mount Devices (SMDs)
These are small leadless electronic components such as resistors, capacitors and integrated circuits. They are soldered directly onto PCBs surface.
2. Surface Mount Connectors:
These connectors like USB ports or HDMI connectors are directly mounted onto PCB is enabling easy interfacing with the other devices.
Properties and Characteristics
Miniaturization: The SMT allows for the smaller component sizes and denser PCB layouts.
Higher Frequencies: The Shorter traces reduce signal interference and enable higher-frequency operation.
Improved Thermal Performance: The Direct contact between components and PCB aids in the better heat dissipation.
Automated Assembly: The Robotic machines automate component placement and increasing production efficiency.
Applications
SMT is used in a wide range of electronics, including:
Consumer electronics: The Mobile phones, laptops and TVs.
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Automotive electronics: The Engine control units and infotainment systems.
Industrial equipment: The PLCs control panels.
Medical devices: Imaging equipment and monitoring devices.
Example
Consider a mobile s PCB assembly. Surface mount components are densely placed on PCBs surface is allowing for compact and lightweight design.
Difference Between terms SMT and SMD
Characteristics
SMT
SMD
Definition
The method for the assembling electronic components onto the PCBs without inserting leads through holes.
The individual electronic components designed for the mounting directly onto the PCB surfaces.
Scope
The Encompasses the entire process of the assembling components onto PCB surface including placement, inspection and testing.
The Refers specifically to components that are mounted onto PCB surface using the SMT techniques.
Process Stages
Involves component placement solder paste application or reflow soldering and potentially cleaning.
The Focuses on individual components physical design and form such as resistors and integrated circuits.
Key Importance
The Methodology for the assembling electronics.
The Components designed for the direct surface mounting components designed for the direct surface mounting.
Advantages
Space Efficiency: The Components are placed on both sides of PCB maximizing space utilization.
Cost-Effective: To Automated assembly reduces labor costs and enhances production speed.
Better Signal Integrity: The Shorter traces result in the reduced signal interference.
Disadvantages
Rework Challenges: The Removing and replacing SMT components can be difficult due to their small size.
Initial Investment: The Setting up SMT production lines requires substantial investment in equipment.
Conclusion
Surface Mount Technology has transformed the electronics industry by enabling the miniaturization and streamlining manufacturing processes. From smartphones to the industrial machinery SMT is the driving force behind the production of the modern electronic devices and Understanding its working , properties and applications empowers engineers and enthusiasts to design and build innovative electronics that meet the demands of digital era.
FAQs on Surface Mount
Q.1: Are SMT components more reliable than through-hole components?
Answer:
The SMT components are generally considered more reliable due to their compact design and reduced susceptibility to mechanical stress.
Q.2: Can SMT components be used for high-power applications?
Answer:
Yes, SMT components can handle high-power applications with the proper thermal management.
Q.3: Are there size limitations for SMT components?
Answer:
While SMT enables miniaturization extremely small components can pose challenges during the assembly and inspection.
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